WL Add On Heating Platform For iPhone 11 – 11 Pro Max motherboard PCB Separation
INCLUDES: Motherboard Layered Module
CONDITION: New
DESCRIPTION:
Connected to W smart soldering station, this module supports the expansion of the motherboard’s layering, lamination, tin planting, only heating the middle column, protects the motherboard IC from being damage and can safely remove the middle column of the motherboard
COMPATIBILITY: Support 11-11 Pro Max
£35.00
Additional information
| Weight | 0.5 kg |
|---|
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